Dual-sided brush spin cleaning device (post-CMP cleaning) *Test machine available
It is a device that cleans the surface and back of the wafer with a brush at the same time.
By combining with two-fluid cleaning, it is possible to remove strong adherents and fine particles. It is mainly used for cleaning after CMP. Example of equipment configuration: Loader ⇒ 1. Brush cleaning chamber ⇒ 2. Rinse drying chamber ⇒ Unloader 1. Brush cleaning chamber ⇒ Chemical shower → Double-sided brush cleaning → Pure water rinse 2. Rinse drying chamber ⇒ Two-fluid (N2 + pure) cleaning → MS shower (optional) → N2 blow drying
- Company：ダルトン
- Price：Other
